A Simple Nickel Activation Process for Electroless Nickel-Phosphorus Plating on Carbon Fiber

Electroless Nickel Plating with Hypophosphite

In the previous chapter, the components of electroless nickel plating baths were discussed from the viewpoint of the function each performs in the bath, with little attention paid to their effect on the plating process. The metal and the electron source (the reducing agent) are consumed in the electroless plating reaction and so their concentrations in the bath are continuously decreasing. Ther...

Electroless Nickel Plating: Bath Control

In this paper, bath control is proposed for the electroless nickel plating through holes board process. The main parameters of the product (board) – thickness of the plating film and phosphorous content – are stabilized at constant levels using optimal tracking control. The set point for control is calculated from the model in dependence on the current state of the process. The pH-index and nic...

Electroless Nickel Plating on Magnesium Alloy

he inherent lightness and good strength-to-weight ratio of T magnesium has focused attention on increasing applications in aerospace and allied fields. Its density is two thirds that of aluminum-a conventional structure material for aerospace. Magnesium has one drawback: It is prone to atmospheric corrosion. Further, because of its high chemical affinity for aqueous solutions, it is categorized...

Bath and Deposit Monitoring System for Electroless Nickel Plating Process

Electroless nickel plating is a widely used plating method in many industries. The usability of the coating is, however, restricted by the control problems related to the electroless nickel plating process. To ensure deposit quality, the transcendent properties of electroless nickel deposit should be accurately controlled during plating, which is challenging because of the spontaneous, unstable...

Electroless Nickel Plating: Pcb Process Modelling and Estimation